SunLED
sunled
A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build-up during assembly process. /Asset/Xd.png
A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build-up during assembly process. /Asset/XZFBGA10A.jpg
Plastic Leaded Chip Carrier (PLCC) Surface-Mount Light Emitting Diodes (LED)
(3) /Asset/XZMDKCBDDG45S-9-Secondary.png
Single Digit Numeric Displays
Common Anode, Right Hand Decimal.A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build-up during assembly process. /Asset/Xd.png
Light Bars
A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build-up during assembly process. /Asset/XEMG30D.png 10 Segment Bar Graph Array Displays
A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process. /Asset/XGURX10D.png
T-1 3/4 Bi-Color Indicator Lamps
A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process. /Asset/XLUGR59M.png
Three Position Construction Backlog Indicator (CBI) Housing Light Emitting Diodes (LED)
(2) A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process. /Asset/XPZ3LUGR37M.png
Right Angle Bi-Color Surface Mount Device (SMD) Chip Light Emitting Diode (LED) Lamps
A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process. /Asset/XZ88W-TS22-10K.png
Right Angle Surface Mount Device (SMD) Chip Light Emitting Diode (LED) Lamps
(6) /Asset/XZBBA56W.jpg Right Angle Full-Color Surface Mount Device (SMD) Chip Light Emitting Diode (LED) Lamps
/Asset/XZCBDBGAME56W-3.png Surface Mount Displays
(3) Common Anode, Right Hand Decimal.A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build-up during assembly process. /Asset/XZFBGA10A.jpg
