Surface Mount (SMT) Zener Diodes
Diodes
Unit of Measure
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BZX84C4V7-7-F 3.0 Microampere (?A) Maximum Reverse Current (IR) Surface Mount (SMT) Zener Diode List Price QUOTE
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BZX84C5V1-7-F 2.0 Microampere (?A) Maximum Reverse Current (IR) Surface Mount (SMT) Zener Diode List Price QUOTE
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| Manufacturer Stock | N/A {0} | N/A {0} | ||
| Description | N/A | |||
| Brands | N/A Diodes Incorporated® | |||
| Manufacturer | N/A Diodes Incorporated� | |||
| Compliance | N/A Standard | |||
| Case | N/A SOT23 | |||
| Case Material | N/A Molded Plastic | |||
| Moisture Sensitivity | N/A Level 1 per J-STD-020 | |||
| Terminals | N/A Matte Tin Finish Annealed over Alloy 42 Lead frame (Lead Free Plating). Solderable per MIL-STD-202, Method 208 | |||
| Packaging | N/A 3000/Tape & Reel | |||
| Forward Voltage (VF) at IF = 10 Milliampere (mA) | N/A 0.9 V | |||
| Power Dissipation (PD) | N/A 300 mW350 mW | |||
| Thermal Resistance Junction to Ambient (RθJA | N/A 357 ºC/W417 ºC/W | |||
| Operating and Storage Temperature Range (TJ, TSTG) | N/A -65 to +150 ºC | |||
| Nominal Zener Voltage (VZ) at IZT | N/A 4.7 V | N/A 5.1 V | ||
| Minimum Zener Voltage (VZ) at IZT | N/A 4.4 V | N/A 4.8 V | ||
| Maximum Zener Voltage (VZ) at IZT | N/A 5 V | N/A 5.4 V | ||
| Zener Current (IZT) | N/A 5 V | |||
| Maximum Zener Impedance (ZZT) f= 1 Kilohertz (kHz) at IZT | N/A 80 Ω | N/A 60 Ω | ||
| Maximum Zener Impedance (ZZT) f= 1 Kilohertz (kHz) at IZK | N/A 500 Ω | N/A 480 Ω | ||
| Maximum Zener Current (ZZT) f= 1 Kilohertz (kHz) at IZK | N/A 1 mA | |||
| Maximum Reverse Current (IR) | N/A 3 µA | N/A 2 µA | ||
| Maximum Reverse Voltage (VR) | N/A 2 V | |||
| Minimum Temperature Coefficient at IZT | N/A -3.5 mV/ºC | N/A -2.7 mV/ºC | ||
| Maximum Temperature Coefficient at IZT | N/A 0.2 mV/ºC | N/A 1.2 mV/ºC | ||
| Approximate Weight | N/A 0.008 g | |||
| Industry Standards | N/A Flammability: Underwriters Laboratories (UL) 94V-0 Restriction of Hazardous Substances (RoHS) Compliant | |||
| Features |
N/A
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| Note for Zener Voltage | N/A Short duration pulse test used to minimize self-heating effect. | |||
| Note |
N/A
Note for Power Dissipation and Thermal Resistance, Junction to Ambient Air: Device mounted on FR-4 PC board with recommended pad layout. Valid provided the terminals are kept at ambient temperature. |
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